Selection 1: Packaging method and process: Hermetic packaging (TO-CAN, BOX, butterfly), non-hermetic packaging (COB, COC, etc. Analyzes the requirements of optical transceivers and discusses packaging methods and optical chip types to understand their design and manufacturing process. Each option is directly related to certain performance requirements of the product and is. In this example, Ansys Circuit and INTERCONNECT are used to perform an electro-optical signal integrity simulation of a 2. 5D integrated optical transceiver.